A SIMPLE METHOD FOR FABRICATING SUB-MICRON LINES

被引：8

作者：

SPEIDELL, JL

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1981年 / 19卷 / 03期

关键词：

INTEGRATED CIRCUIT MANUFACTURE;

D O I：

10.1116/1.571087

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A process for fabricating submicron lines using photolithography and vacuum evaporation is presented. In this process, a photoresist layer is deposited and treated to obtain an undercut profile using chlorobenzene. The submicron line is then deposited by direct evaporation onto the photoresist edge. Lines as narrow as 0. 06 mu m and aspect ratios ranging from 5:1 to 30:1 have been demonstrated. The process offers several advantages such as simple processing, dimensional control, and a broad materials range.

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页码：693 / 695

页数：3

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