CORRELATION OF TEXTURE WITH ELECTROMIGRATION BEHAVIOR IN AL METALLIZATION

Aluminum films deposited at three different conditions, such that texture is the only microstructural variable, were tested for electromigration behavior. Texture analysis shows that random and (111) fiber texture components are present in the films deposited by both partially ionized beam (PIB), physical vapor deposition and sputtering. Two parameters are required to properly quantify the texture: (111) volume fraction and the distribution (half-width) of the (111) fiber component. As the (111) texture becomes stronger, the median time to failure increases, while the failure standard deviation decreases. Previous texture correlations are based on incomplete information, so they cannot predict electromigration behavior in all cases.