PERFORMANCE-CHARACTERISTICS OF DIAZO-TYPE PHOTORESISTS UNDER E-BEAM AND OPTICAL EXPOSURE

被引:40
作者
SHAW, JM
HATZAKIS, M
机构
[1] Thomas J. Watson Research Center, Yorktown Heights
关键词
D O I
10.1109/T-ED.1978.19102
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The performance characteristics of three different diazotype positive photoresists such as Shipley AZ2400, Kodak 809, and Polychrome PC129, are compared after optical exposure and electron-beam exposure. The development rates for both e-beam and optically exposed resists are measured by an in-situ automated technique using the IBM Film Thickness Analyzer. The optical exposure parameters are obtained at three wavelengths (4358, 4047, and 3650) by computer-controlled transmission measurements. The optical exposure and development parameters permit direct quantitative comparisons for these photoresists. The development rates of e-beam and optically exposed resists are compared. Also a comparison of e-beam sensitivity between the three resist systems is made by studying the resist profile shape after development in the scanning-electron microscope (SEM). Copyright © 1978 by The Institute of Electrical and Electronics Engineers, Inc.
引用
收藏
页码:425 / 430
页数:6
相关论文
共 6 条
  • [1] CHARACTERIZATION OF POSITIVE PHOTORESIST
    DILL, FH
    HORNBERGER, WP
    HAUGE, PS
    SHAW, JM
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1975, ED22 (07) : 445 - 452
  • [2] OPTICAL LITHOGRAPHY
    DILL, FH
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1975, ED22 (07) : 440 - 444
  • [3] RECENT DEVELOPMENTS IN ELECTRON-RESIST EVALUATION TECHNIQUES
    HATZAKIS, M
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1975, 12 (06): : 1276 - 1279
  • [4] KANAYA K, 1966, 6TH P INT C EL MICR
  • [5] INSITU MEASUREMENT OF DIELECTRIC THICKNESS DURING ETCHING OR DEVELOPING PROCESSES
    KONNERTH, KL
    DILL, FH
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1975, ED22 (07) : 452 - 456
  • [6] MATTA RK, 1967, ELECTROCHEM TECHNOL, V5, P382