N-SIXC1-X/P-SI DIODE FABRICATED USING SILANE, 1,1,1-TRICHLOROETHANE, AND ARSINE AT LOW-TEMPERATURES

被引:6
作者
HEBERT, F
机构
[1] Advanced Bipolar Products, AVANTEK, Inc., Newark
关键词
D O I
10.1109/55.116923
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel method for depositing Si(x)Cl1-x alloys on silicon, based on the silane and 1,1,1-trichloroethane gas system, has been investigated in an inexpensive hot-wall horizontal LPCVD reactor. Temperatures in the range of 650 to 800-degrees-C and in-situ doping using arsine were used successfully. The film characteristics were evaluated using electron spectroscopy for chemical analysis (ESCA)(XPS), Fourier transform infrared spectroscopy (FTIR), and optical absorption. N+-P+ heterojunctions with low reverse leakage current and a forward-bias ideality factor of 1.55 were successfully fabricated.
引用
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页码:477 / 479
页数:3
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