REACTIVE ION-BEAM ETCHING WITH CF4 - CHARACTERIZATION OF A KAUFMAN ION-SOURCE AND DETAILS OF SIO2 ETCHING

被引:68
作者
MAYER, TM [1 ]
BARKER, RA [1 ]
机构
[1] BELL TEL LABS INC,MURRAY HILL,NJ 07974
关键词
D O I
10.1149/1.2123929
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:585 / 591
页数:7
相关论文
共 24 条
[1]  
BOSCH MA, 1981, APPL PHYS LETT, V38, P264, DOI 10.1063/1.92338
[2]   REACTIVE ION-BEAM ETCHING OF SIO2 AND POLYCRYSTALLINE SILICON [J].
BROWN, DM ;
HEATH, BA ;
COUTUMAS, T ;
THOMPSON, GR .
APPLIED PHYSICS LETTERS, 1980, 37 (02) :159-161
[3]   ION-ASSISTED AND ELECTRON-ASSISTED GAS-SURFACE CHEMISTRY - IMPORTANT EFFECT IN PLASMA-ETCHING [J].
COBURN, JW ;
WINTERS, HF .
JOURNAL OF APPLIED PHYSICS, 1979, 50 (05) :3189-3196
[4]   A METHOD FOR INCREASING THE ETCH-RATE RATIO OF OXIDES TO NON-OXIDES IN INERT-GAS ION MILLING PROCESSES [J].
GERLACHMEYER, U ;
COBURN, JW ;
KAY, E .
JOURNAL OF APPLIED PHYSICS, 1980, 51 (06) :3362-3364
[5]   ION-ENHANCED GAS-SURFACE CHEMISTRY - THE INFLUENCE OF THE MASS OF THE INCIDENT ION [J].
GERLACHMEYER, U ;
COBURN, JW ;
KAY, E .
SURFACE SCIENCE, 1981, 103 (01) :177-188
[6]   ION ENHANCED GAS-SURFACE REACTIONS - A KINETIC-MODEL FOR THE ETCHING MECHANISM [J].
GERLACHMEYER, U .
SURFACE SCIENCE, 1981, 103 (2-3) :524-534
[7]  
HARPER JME, 1980, ELECTRON ION BEAM SC, P518
[8]   SI AND SIO2 ETCHING CHARACTERISTICS BY FLUOROCARBON ION-BEAM [J].
HORIIKE, Y ;
SHIBAGAKI, M ;
KADONO, K .
JAPANESE JOURNAL OF APPLIED PHYSICS, 1979, 18 (12) :2309-2310
[9]   TECHNOLOGY OF ION-BEAM SOURCES USED IN SPUTTERING [J].
KAUFMAN, HR .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02) :272-276
[10]  
MAISSEL LI, 1970, HDB THIN FILM TECHNO, P3