CHOICE OF POWER-SUPPLY VOLTAGE FOR HALF-MICROMETER AND LOWER SUBMICROMETER CMOS DEVICES

被引:23
作者
KAKUMU, M [1 ]
KINUGAWA, M [1 ]
HASHIMOTO, K [1 ]
机构
[1] TOSHIBA CO LTD,SEMICOND DEVICE ENGN LAB,SAIWAI KU,KAWASAKI 210,JAPAN
关键词
D O I
10.1109/16.108196
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Tradeoff between circuit performance and reliability is theoretically and experimentally examined in detail, down to half-micrometer and lower submicrometer gate lengths, taking into account high-field effects on MOSFET’s. Based upon physical understanding, the authors propose some guidelines for optimum power-supply voltage and process/device parameters for half-micrometer and lower submicrometer CMOS devices, in order to maintain MOS device reliability and achieve high circuit performance. As a result, the authors have experimentally and semi-empirically clarified that power-supply voltage must be reduced to maintain reliability and improved performance, and further, the optimum voltage reduction follows the square root of the design rule. Moreover, trends for scaling down power-supply voltage have been experimentally verified by results obtained from measurements on CMOS devices over a wide range of gate oxide thickness (7–45 nm) and gate lengths (0.3–2.0 µm). © 1990 IEEE
引用
收藏
页码:1334 / 1342
页数:9
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