CORRELATION BETWEEN PROCESS-INDUCED IN-PLANE DISTORTION AND WAFER BOWING IN SILICON

[1] GEGENWARTH RE, 1977, SPIE J, V100, P66

[2] CLOSED BOAT - NEW APPROACH FOR SEMICONDUCTOR BATCH PROCESSING [J]. MICROELECTRONICS AND RELIABILITY, 1976, 15 (01): : 61 - 66

[3] HENDERSON RC, 1977, SPIE, V100, P151

[4] DISLOCATION PINNING EFFECT OF OXYGEN-ATOMS IN SILICON [J]. APPLIED PHYSICS LETTERS, 1977, 31 (02) : 53 - 55

[5] THERMAL-STRESSES AND CRACKING RESISTANCE OF DIELECTRIC FILMS (SIN, SI3N4, AND SIO2) ON SI SUBSTRATES [J]. JOURNAL OF APPLIED PHYSICS, 1978, 49 (04) : 2423 - 2426

[6] E-BEAM WRITING TECHNIQUES FOR SEMICONDUCTOR-DEVICE FABRICATION [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1973, 10 (06): : 1048 - 1051

[7] DIRECT, ELECTRON LITHOGRAPHIC FABRICATION OF SILICON DEVICES AND CIRCUITS [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (03): : 960 - 964

[8] Yourke H. S., 1976, International Electron Devices Meeting. (Technical digest), P431

[9] [No title captured]

[1] GEGENWARTH RE, 1977, SPIE J, V100, P66

[2] CLOSED BOAT - NEW APPROACH FOR SEMICONDUCTOR BATCH PROCESSING [J]. MICROELECTRONICS AND RELIABILITY, 1976, 15 (01): : 61 - 66

[3] HENDERSON RC, 1977, SPIE, V100, P151

[4] DISLOCATION PINNING EFFECT OF OXYGEN-ATOMS IN SILICON [J]. APPLIED PHYSICS LETTERS, 1977, 31 (02) : 53 - 55

[5] THERMAL-STRESSES AND CRACKING RESISTANCE OF DIELECTRIC FILMS (SIN, SI3N4, AND SIO2) ON SI SUBSTRATES [J]. JOURNAL OF APPLIED PHYSICS, 1978, 49 (04) : 2423 - 2426

[6] E-BEAM WRITING TECHNIQUES FOR SEMICONDUCTOR-DEVICE FABRICATION [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1973, 10 (06): : 1048 - 1051

[7] DIRECT, ELECTRON LITHOGRAPHIC FABRICATION OF SILICON DEVICES AND CIRCUITS [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (03): : 960 - 964

[8] Yourke H. S., 1976, International Electron Devices Meeting. (Technical digest), P431

[9] [No title captured]