ROLE OF COPPER IN ELECTROMIGRATION LIFETIMES OF ALUMINUM-ALLOY CONDUCTORS

被引：5

作者：

LLOYD, JR

机构：

[1] Digital Equipment Corporation, Hudson

来源：

APPLIED PHYSICS LETTERS | 1990年 / 57卷 / 11期

关键词：

D O I：

10.1063/1.103518

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Recent experimental results have indicated that the traditionally conceived role of copper in Al/Cu alloys in electromigration resistance may not be correct. A simple model is proposed based on Al/Cu intermetallic precipitates acting as local diffusion barriers limiting vacancy availability.

引用

页码：1167 / 1168

页数：2

共 8 条

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