SPREAD OF TIME-TO-FAILURE MEASUREMENTS IN THIN METALLIC FILMS

被引：9

作者：

BOBBIO, A ^{[1
]}

SARACCO, O ^{[1
]}

机构：

[1] IST ELETTOTECNICO NAZL GALILEO FERRARIS,TURIN,ITALY

来源：

THIN SOLID FILMS | 1973年 / 17卷 / 01期

关键词：

D O I：

10.1016/0040-6090(73)90016-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：S13 / S16

页数：4

相关论文

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[2] ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS
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