TENSILE PROPERTIES OF ALUMINUM ALUMINA MULTILAYERED THIN-FILMS

被引:58
作者
MEARINI, GT [1 ]
HOFFMAN, RW [1 ]
机构
[1] CASE WESTERN RESERVE UNIV,DEPT PHYS,CLEVELAND,OH 44105
关键词
ALUMINA; ALUMINUM; MECHANICAL PROPERTIES; MULTILAYER; THIN FILMS;
D O I
10.1007/BF02666408
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Thin, free standing aluminum and alumina films were produced by physical vapor deposition and tensile properties were measured. Young's modulus of the aluminum was microstructure insensitive, but the plastic behavior was very structure sensitive. The natural surface oxide of the aluminum had no apparent affect on the measured value of Young's modulus. The alumina films showed true brittle behavior, but Young's modulus was lower than bulk. Impurities residing at the grain boundaries were observed in the aluminum films using transverse Auger electron spectroscopy (AES). The films were well characterized using AES, transmission electron microscopy, Rutherford backscattering spectroscopy, and secondary electron microscopy. Well characterized, thin three-layered aluminum/alumina compositionally modulated films were produced by alternate depositions and tensile properties were measured. Young's modulus was found to be less than a weighted thickness average of Young's modulus of the individual constituents. Otherwise, the mechanical measurements yielded typical bulk behavior.
引用
收藏
页码:623 / 629
页数:7
相关论文
共 19 条
[11]  
HOFFMAN RW, 1989, MATER RES SOC S P, V130, P295
[12]   NATURAL AND THERMALLY FORMED OXIDE FILMS ON ALUMINUM [J].
HUNTER, MS ;
FOWLE, P .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1956, 103 (09) :482-485
[13]   STRESS-RELAXATION IN THIN ALUMINUM FILMS [J].
KOLESHKO, VM ;
BELITSKY, VF ;
KIRYUSHIN, IV .
THIN SOLID FILMS, 1986, 142 (02) :199-212
[14]   3-DIMENSIONAL FINITE-ELEMENT ANALYSIS OF THIN-FILM STRESSES USING ALGOR PERSONAL-COMPUTER-BASED SOFTWARE [J].
KRUS, D ;
MEARINI, G ;
CHAFFEE, K ;
HOFFMAN, RW .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1991, 9 (04) :2488-2493
[15]   STRENGTH VERSUS THICKNESS IN VAPOR DEPOSITED ALUMINUM FILMS [J].
MILILLO, FF ;
DANTONIO, C ;
BAUER, RW .
THIN SOLID FILMS, 1969, 3 (01) :51-&
[16]   THERMAL STRAIN IN LEAD THIN-FILMS .2. STRAIN RELAXATION MECHANISMS [J].
MURAKAMI, M .
THIN SOLID FILMS, 1978, 55 (01) :101-111
[17]  
PRUNIAUX B, 1967, THIN SOLID FILMS, V1, P417
[18]   CHARACTERIZATION OF AL2O3 FILMS DEPOSITED BY VARIOUS METHODS [J].
RAJOPADHYE, NR ;
DAKE, SB ;
BHORASKAR, SV .
THIN SOLID FILMS, 1986, 142 (01) :127-138
[19]   VICTAWET AND SODIUM METAPHOSPHATE AS PARTING AGENTS FOR ELECTRON MICROSCOPE REPLICAS [J].
STIEGLER, JO ;
NOGGLE, TS .
REVIEW OF SCIENTIFIC INSTRUMENTS, 1961, 32 (04) :406-&