MULTICHIP MODULE USING MULTILAYER YBA2CU3O7-DELTA INTERCONNECTS

We report the first use of high temperature superconductors for multilayer interconnection of bare semiconductor die to form multichip modules. Ten die with a total of 160 pads were interconnected on a 3.4 cm2 substrate. The interconnections were a combination of YBa2Cu3O7-delta lines and vias on two wiring levels separated by an epitaxial insulating layer. Connection between the two YBa2Cu3O7-delta wiring layers was accomplished by the use of superconducting vias through the insulator. Two similar multilayer multichip module designs, with 30- and 10-mum-wide YBa2Cu3Odelta-7 lines, were constructed.