MINORITY-CARRIER LIFETIME IN SILICON AFTER AR+ AND SI+ IMPLANTATION

被引:22
作者
KAPPERT, HF [1 ]
SIXT, G [1 ]
SCHWUTTKE, GH [1 ]
机构
[1] IBM CORP,E FISHKILL FACIL,HOPEWELL JUNCTION,NY 12533
来源
PHYSICA STATUS SOLIDI A-APPLIED RESEARCH | 1979年 / 52卷 / 02期
关键词
D O I
10.1002/pssa.2210520214
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Minority carrier lifetime changes in MOS diodes implanted with 200 keV Ar+ or 80 keV Si+ in the dose range 1011 to 1016 ions/cm2 are investigated and related to the implanted ions and the damage in the substrate. Lifetime degradation observed after Ar+ implantation varies with the dose. A factor of 105 is achieved by implanting a dose of 1015 Ar+/cm−2. Contrarily Si+ implantation does not affect the lifetime up to 1014 Si+/cm2. For a higher Si+ dose the lifetime is reduced by four orders of magnitude. Transmission electron microscopy studies reveal no defects for implants up to 1012 Ar+/cm2 and 1014 Si+/cm2. At higher argon dose bubble like defects are identified. For Ar+ and Si+ ion doses close to the amorphization dose stacking faults and dislocation loops are observed additionally. Copyright © 1979 WILEY‐VCH Verlag GmbH & Co. KGaA
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页码:463 / 474
页数:12
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