THE CONSTRUCTION AND USE OF THIN-FILM THERMOCOUPLES FOR THE MEASUREMENT OF SURFACE-TEMPERATURE - APPLICATIONS TO SUBSTRATE-TEMPERATURE DETERMINATION AND THERMAL BENDING OF A CANTILEVERED PLATE DURING FILM DEPOSITION

被引：17

作者：

LAUGIER, M ^{[1
]}

机构：

[1] UNIV AIX MARSEILLE 3, ELECTR LAB, F-13397 MARSEILLES 4, FRANCE

来源：

THIN SOLID FILMS | 1980年 / 67卷 / 01期

关键词：

D O I：

10.1016/0040-6090(80)90300-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：163 / 170

页数：8

共 17 条

[1] DEVELOPMENT OF STRESS AND SURFACE TEMPERATURE DURING DEPOSITION OF LITHIUM FLUORIDE FILMS [J].

BLACKBURN, H ;

CAMPBELL, DS .

PHILOSOPHICAL MAGAZINE, 1963, 8 (89) :823-+

[2] THERMOPOWER IN THIN-FILM COPPER-CONSTANTAN COUPLES [J].

CHOPRA, KL ;

BAHL, SK ;

RANDLETT, MR .

JOURNAL OF APPLIED PHYSICS, 1968, 39 (03) :1525-&

[3] STRESSES DEVELOPED IN OPTICAL FILM COATINGS [J].

ENNOS, AE .

APPLIED OPTICS, 1966, 5 (01) :51-&

[4] THERMAL ASPECTS OF THE GROWTH OF THIN FILMS BY VACUUM SUBLIMATION [J].

GAFNER, G .

PHILOSOPHICAL MAGAZINE, 1960, 5 (58) :1041-1048

[5] SUBSTRATE-TEMPERATURE MEASUREMENT AND CONTROL [J].

HANSON, MM ;

OBERG, PE ;

TOLMAN, CH .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1966, 3 (05) :277-&

[6] THE CAUSE OF STRESS IN EVAPORATED METAL FILMS [J].

HOFFMAN, RW ;

DANIELS, RD ;

CRITTENDEN, EC .

PROCEEDINGS OF THE PHYSICAL SOCIETY OF LONDON SECTION B, 1954, 67 (414) :497-500

[7]

HOFFMAN RW, 1966, PHYSICS THIN FILMS, V3

[8]

HOLLAND L, 1956, VACUUM DEPOSITION TH

[9] INTRINSIC STRESS IN EVAPORATED METAL FILMS [J].

KLOKHOLM, E ;

BERRY, BS .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1968, 115 (08) :823-&

[10] ANALYSIS OF SUBSTRATE BENDING DURING EVAPORATION OF THIN-FILMS DUE TO A SMALL TEMPERATURE DIFFERENCE BETWEEN THE SUBSTRATE FACES [J].

LAUGIER, M .

THIN SOLID FILMS, 1980, 66 (02) :L11-L14

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