THERMAL-STRESSES IN ALUMINUM LINES BONDED TO SUBSTRATES

被引：85

作者：

SAUTER, AI ^{[1
]}

NIX, WD ^{[1
]}

机构：

[1] STANFORD UNIV,DEPT MAT SCI & ENGN,STANFORD,CA 94305

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1992年 / 15卷 / 04期

关键词：

D O I：

10.1109/33.159891

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Thermal stresses in unpassivated and passivated aluminum thin film lines bonded to substrates have been calculated using finite element techniques. For the unpassivated lines, only elastic behavior was considered. The stresses were found to increase with increasing linewidth and with increasing substrate rigidity. Edge effects were found to become non-negligible for narrow lines. For passivated lines, allowed to deform either elastically or in elastic perfectly plastic manner, the stresses increase with decreasing linewidth, with increasing passivation thickness, and with increasing passivation stiffness. Stresses in elastic perfectly plastic lines are slightly lower and have flatter profiles than stresses in purely elastic lines.

引用

页码：594 / 600

页数：7

共 19 条

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