HILLOCK GROWTH ON VACUUM-DEPOSITED ALUMINUM FILMS

被引:54
作者
HERMAN, DS
SCHUSTER, MA
GERBER, RM
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1972年 / 9卷 / 01期
关键词
D O I
10.1116/1.1316673
中图分类号
O59 [应用物理学];
学科分类号
摘要
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页码:515 / &
相关论文
共 12 条
[1]   REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J].
AMES, I ;
DHEURLE, FM ;
HORSTMANN, RE .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) :461-+
[2]  
BHATT HJ, 1970, OCT IEEE M EL DEV WA
[3]   MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS [J].
CHAUDHARI, P .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (02) :197-+
[4]  
DHEURLE F, 1968, T METALL SOC AIME, V242, P502
[5]   ALUMINUM FILMS DEPOSITED BY RF SPUTTERING [J].
DHEURLE, FM .
METALLURGICAL TRANSACTIONS, 1970, 1 (03) :725-&
[6]   MORPHOLOGY OF VOID-HILLOCK FORMATION AT TRANSVERSE SCRATCHES IN ALUMINUM THIN FILM [J].
HOWARD, JK ;
ROSS, RF .
JOURNAL OF APPLIED PHYSICS, 1971, 42 (07) :2996-&
[7]   STRESS RELIEF AND HILLOCK FORMATION IN THIN LEAD FILMS [J].
LAHIRI, SK .
JOURNAL OF APPLIED PHYSICS, 1970, 41 (07) :3172-&
[8]   REVERSIBLE HILLOCK GROWTH IN THIN FILMS [J].
LAHIRI, SK ;
WELLS, OC .
APPLIED PHYSICS LETTERS, 1969, 15 (07) :234-&
[9]  
LEARN AJ, 1971, MAR IEEE REL PHYS S
[10]   HILLOCK GROWTH AND STRESS RELIEF IN SPUTTERED AU FILMS [J].
PENNEBAKER, WB .
JOURNAL OF APPLIED PHYSICS, 1969, 40 (01) :394-+