A solder self-assembled large angular displacement torsional electrostatic micromirror

被引:5
作者
McCarthy, B [1 ]
Bright, VM [1 ]
Neff, JA [1 ]
机构
[1] Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USA
来源
FIFTEENTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2002年
关键词
D O I
10.1109/MEMSYS.2002.984318
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 [电气工程]; 0809 [电子科学与技术];
摘要
Solder self-assembled micromirrors have the advantages of rigid electrical and structural connections to the substrate as well as compact assembly mechanisms. In addition solder assembly allows a structure to be rotated to any angle desired. In this work, these advantages are used to produce a novel electrostatic micromirror that can stably rotate +/-10degrees from its assembled position. The compact solder mechanism allows each of three mirror components to be assembled independently to individual angles. After assembly the design is statically tested and compared to both analytical and finite element (FE) model results.
引用
收藏
页码:499 / 502
页数:4
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