In situ measurement of mechanical properties of polyimide films using micromachined resonant string structures

被引:13
作者
Kim, YJ [1 ]
Allen, MG
机构
[1] Samsung Elect Co Ltd, Ctr Corp Res & Dev, Optomechatron Lab, Suwon 442742, Kyungki Do, South Korea
[2] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 1999年 / 22卷 / 02期
基金
美国国家科学基金会;
关键词
adhesion; in situ measurement; micromachining; residual stress; resonant structure; string;
D O I
10.1109/6144.774746
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Two irt situ measurement schemes, using micromachined resonant string structures, for the measurement of the polyimide residual stress and polyimide/metal adhesion durability have been developed. The residual stress of polyimide films, DuPont PI-2555 and PI-2611, have been measured using a bulk micromachined string structure. According to the Rayleigh's method, the resonant frequency of a polyimide string can be related to the film stress. By measuring the resonant frequency of these polyimide strings, the residual stresses have been calculated. The measurement results of various strings have been compared with conventional measurement results, which shows that they are in good agreement, Also, a noble scheme to quantize the adhesion durability between a polyimide film and a metal film has been developed. This scheme is based on a polyimide/metal bimorph string structures, fabricated using a surface micromachining technique, vibrating with an alternating potential, The change of resonance profile of this string structure can be related to the degradation of adhesion strength at the polyimide/metal interface. Various polyimide/gold string structures have been fabricated using a surface micromachining with Cu sacrificial layers, and the resonant qualities have been monitored. Notable changes of resonant Q-factor and resonant frequency, due to the degradation of adhesion between the metal and polyimide, have been observed after 10(8) cycles (string vibration) for the polyimide/gold bimorph strings. The changes of resonant Q-factor and resonant frequency over a time period (vibration cycles) have been monitored.
引用
收藏
页码:282 / 290
页数:9
相关论文
共 10 条
[1]   MICROFABRICATED STRUCTURES FOR THE INSITU MEASUREMENT OF RESIDUAL-STRESS, YOUNGS MODULUS, AND ULTIMATE STRAIN OF THIN-FILMS [J].
ALLEN, MG ;
MEHREGANY, M ;
HOWE, RT ;
SENTURIA, SD .
APPLIED PHYSICS LETTERS, 1987, 51 (04) :241-243
[2]   PROCESSING AND PERFORMANCE OF GOLD MCMS [J].
CLOUD, TA ;
HOUSTON, MR ;
KOHL, PA ;
BIDSTRUP, SA .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (07) :724-730
[3]   A SIMPLE TECHNIQUE FOR THE DETERMINATION OF MECHANICAL STRAIN IN THIN-FILMS WITH APPLICATIONS TO POLYSILICON [J].
GUCKEL, H ;
RANDAZZO, T ;
BURNS, DW .
JOURNAL OF APPLIED PHYSICS, 1985, 57 (05) :1671-1675
[4]  
Harris C., 1988, SHOCK VIBRATION HDB
[5]   STRESS IN POLYCRYSTALLINE AND AMORPHOUS-SILICON THIN-FILMS [J].
HOWE, RT ;
MULLER, RS .
JOURNAL OF APPLIED PHYSICS, 1983, 54 (08) :4674-4675
[6]  
Kim Y. W., 1991, P TRANSD 91 INT C SO, P651
[7]   MECHANICAL-PROPERTIES OF THIN-FILMS [J].
NIX, WD .
METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1989, 20 (11) :2217-2245
[8]   YOUNGS MODULUS MEASUREMENTS OF THIN-FILMS USING MICROMECHANICS [J].
PETERSEN, KE ;
GUARNIERI, CR .
JOURNAL OF APPLIED PHYSICS, 1979, 50 (11) :6761-6766
[9]  
SENTURIA SD, 1987, P IEEE MICR TEL WORK
[10]  
TIMOSHENKO, 1955, VIBRATION PROBLEMS E