Characterization of multicusp-plasma ion source brightness using micron-scale apertures

被引:7
作者
Scott, KL [1 ]
King, TJ
Leung, KN
Pease, RF
机构
[1] Univ Calif Berkeley, Lawrence Berkeley Natl Lab, Berkeley, CA 94720 USA
[2] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
[3] Stanford Univ, Dept Elect Engn & Comp Sci, Stanford, CA 94720 USA
[4] Stanford Univ, Dept Nucl Engn & Comp Sci, Stanford, CA 94720 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2001年 / 19卷 / 06期
关键词
D O I
10.1116/1.1414019
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The brightness of a multicusp-plasma ion source was characterized to determine its suitability for a proposed maskless ion-beam lithography system. In order to be competitive with similar systems utilizin- electron sources, the brightness requirement must be met to satisfy throughput demands. For this requirement, 1 nA into each beam diameter of 50 nm is needed at the target plane; this implies a brightness of about 1000 A/cm(2)/sr at the entrance to the objective lens. The brightness of the source has been characterized using 5-mum-diam extraction apertures under two different extraction configurations: (1) with the apertures directly illuminated by the source and (2) with the apertures flooded using an extraction system. The maximum brightness achieved for either configuration was 15 A/cm(2)/sr at 3 keV beam energy, He+ ions, and continuous wave operation. Although this configuration falls short of the requirement for high-throughput exposures, it is also possible to operate the multicusp-plasma ion source in pulsed mode. This would give higher current densities, which may also give adequate brightness as well. (C) 2001 American Vacuum Society.
引用
收藏
页码:2602 / 2606
页数:5
相关论文
共 11 条
[1]   MASKED ION-BEAM LITHOGRAPHY - A FEASIBILITY DEMONSTRATION FOR SUBMICROMETER DEVICE FABRICATION [J].
BARTELT, JL ;
SLAYMAN, CW ;
WOOD, JE ;
CHEN, JY ;
MCKENNA, CM ;
MINNING, CP ;
COAKLEY, JF ;
HOLMAN, RE ;
PERRYGO, CM .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (04) :1166-1171
[2]  
Baum AW, 1995, P SOC PHOTO-OPT INS, V2522, P208, DOI 10.1117/12.221575
[3]   Electron beam technology - SEM to microcolumn [J].
Chang, THP ;
Thomson, MGR ;
Yu, ML ;
Kratschmer, E ;
Kim, HS ;
Lee, KY ;
Rishton, SA ;
Zolgharnain, S .
MICROELECTRONIC ENGINEERING, 1996, 32 (1-4) :113-130
[4]  
DEJULE R, 1999, SEMICONDUCTOR INT
[5]   400-A HIGH ASPECT-RATIO LINES PRODUCED IN POLYMETHYL METHACRYLATE (PMMA) BY ION-BEAM EXPOSURE [J].
KARAPIPERIS, L ;
LEE, CA .
APPLIED PHYSICS LETTERS, 1979, 35 (05) :395-397
[6]  
LEUNG KN, 1992, 3 EUR PART ACC C EPA
[7]   Atomic structure and electrical properties of a supertip gas field-ion source [J].
Miller, T ;
Knoblauch, A ;
Kalbitzer, S .
MATERIALS SCIENCE APPLICATIONS OF ION BEAM TECHNIQUES, 1997, 248-2 :433-438
[8]   Pattern generators and microcolumns far ion beam lithography [J].
Scott, KL ;
King, TJ ;
Lieberman, MA ;
Leung, KN .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2000, 18 (06) :3172-3176
[9]  
SEPTIER A, 1967, FOCUSING CHARGED PAR, V2, P133
[10]  
WILSON RG, 1979, ION BEAMS APPL ION I, P253