Microlens array produced using hot embossing process

被引：168

作者：

Ong, NS ^{[1
]}

Koh, YH ^{[1
]}

Fu, YQ ^{[1
]}

机构：

[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore

来源：

MICROELECTRONIC ENGINEERING | 2002年 / 60卷 / 3-4期

关键词：

microlens array; focused ion beams; hot embossing;

D O I：

10.1016/S0167-9317(01)00695-5

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, the fabrication of molds that are suitable for the production of microlens arrays using the replication technique is discussed. Variation of parameters in the replication process were investigated. A focused ion beam was used to fabricate the microlens cavities on three materials, with silicon showing the best result. Hot embossing was used to produce replicated polycarbonate lens array. The temperature of the mold and the embossing force were the two parameters varied. The microlens array produced using the embossing replication process demonstrates the possibility of nanometre fabrication. (C) 2002 Elsevier Science B.V. All rights reserved.

引用

页码：365 / 379

页数：15

共 14 条

[1] Hot embossing as a method for the fabrication of polymer high aspect ratio structures [J].

Becker, H ;

Heim, U .

SENSORS AND ACTUATORS A-PHYSICAL, 2000, 83 (1-3) :130-135

[2] Silicon as tool material for polymer hot embossing [J].

Becker, H ;

Heim, U .

MEMS '99: TWELFTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 1999, :228-231

[3]

Borelli N. F., 1999, MICROOPTICS TECHNOLO

[4] Influence analysis of dwell time on focused ion beam micromachining in silicon [J].

Fu, YQ ;

Bryan, NKA ;

Shing, ON ;

Wyan, HNP .

SENSORS AND ACTUATORS A-PHYSICAL, 2000, 79 (03) :230-234

[5] Microfabrication of diffractive optical element with continuous relief by focused ion beam [J].

Fu, YQ ;

Kok, N ;

Bryan, A ;

Shing, ON .

MICROELECTRONIC ENGINEERING, 2000, 54 (3-4) :287-293

[6] Microfabrication of microlens array by focused ion beam technology [J].

Fu, YQ ;

Kok, N ;

Bryan, A .

MICROELECTRONIC ENGINEERING, 2000, 54 (3-4) :211-221

[7] Flow behaviour of thin polymer films used for hot embossing lithography [J].

Heyderman, LJ ;

Schift, H ;

David, C ;

Gobrecht, J ;

Schweizer, T .

MICROELECTRONIC ENGINEERING, 2000, 54 (3-4) :229-245

[8]

Hutley M., 1991, P SPIIE, V1573, P110

[9] Hot embossing in polymers as a direct way to pattern resist [J].

Jaszewski, RW ;

Schift, H ;

Gobrecht, J ;

Smith, P .

MICROELECTRONIC ENGINEERING, 1998, 42 :575-578

[10] Microfabrication using silicon mold inserts and hot embossing [J].

Lin, LW ;

Chiu, CJ ;

Bacher, W ;

Heckele, M .

MHS '96 - PROCEEDINGS OF THE SEVENTH INTERNATIONAL SYMPOSIUM ON MICRO MACHINE AND HUMAN SCIENCE: TOWARD MICRO-MECHATRONICS IN 21ST CENTURY, 1996, :67-71

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