Selective electroless copper deposition within block copolymer microdomains

被引：35

作者：

Boontongkong, Y ^{[1
]}

Cohen, RE ^{[1
]}

Rubner, MF ^{[1
]}

机构：

[1] MIT, Ctr Mat Sci & Engn, Cambridge, MA 02139 USA

来源：

CHEMISTRY OF MATERIALS | 2000年 / 12卷 / 06期

关键词：

D O I：

10.1021/cm990804h

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

We demonstrate a method for the directed formation of layered metallic copper structure within the subsurface morphology of a bulk lamellar block copolymer. Using an electroless deposition process, copper was selectively deposited inside the interconnected microdomain network of the water-permeable block containing preloaded palladium ions. The relatively simple process yields a novel nanoscale composite consisting of alternating layers of metallic copper with those of the hydrocarbon block matrix. The extent of the copper deposition can be controlled by adjusting the deposition rate and deposition time.

引用

页码：1628 / 1633

页数：6

共 16 条

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