A robust polymer microcable structure for flexible devices

被引:24
作者
Kim, Eric [1 ]
Tu, Hongen [1 ]
Lv, Cheng [2 ]
Jiang, Hanqing [2 ]
Yu, Hongyu [3 ]
Xu, Yong [1 ]
机构
[1] Wayne State Univ, Detroit, MI 48202 USA
[2] Arizona State Univ, Sch Engn Matter Transport & Energy, Tempe, AZ 85287 USA
[3] Arizona State Univ, Sch Elect Comp & Energy Engn, Tempe, AZ 85287 USA
基金
美国国家科学基金会;
关键词
THIN-FILM TRANSISTORS; STRESS SENSOR SKIN; LARGE-AREA; PRINTABLE FORM; SILICON; TECHNOLOGY;
D O I
10.1063/1.4788917
中图分类号
O59 [应用物理学];
学科分类号
摘要
This letter reports a parylene cable structure that can significantly increase the robustness of flexible devices based on a silicon-island structure. In our previous work, it has been observed that the flexible cables connecting silicon islands could experience stress concentration at the edge of the silicon islands and fracture the metal traces. To address this issue, a micro cushion structure based on parylene micro-channels is proposed to minimize the stress concentration. This structure also improves the overall mechanical strength of the cables, and provides a simple method to encapsulate metal traces reliably. (C) 2013 American Institute of Physics. [http://dx.doi.org/10.1063/1.4788917]
引用
收藏
页数:4
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