Multichip module packaging of microelectromechanical systems

被引：12

作者：

Butler, JT ^{[1
]}

Bright, VM

Comtois, JH

机构：

[1] USAF, Inst Technol, Dept Elect & Comp Engn, Wright Patterson AFB, OH 45433 USA

[2] Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USA

[3] USAF, Res Lab, Kirtland AFB, NM 87117 USA

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1998年 / 70卷 / 1-2期

关键词：

multichip modules; packaging; microelectromechanical systems (MEMS);

D O I：

10.1016/S0924-4247(98)00107-1

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Methods of packaging microelectromechanical systems (MEMS) using two advanced multichip module (MCM) foundry processes are described. Special-purpose surface and bulk micromachined MEMS packaging test dies were designed and fabricated. The MEMS test dies were successfully packaged with CMOS electronics dies using the 'chips first' General Electric high-density interconnect (HDI) technology. Methods for reducing the potential for laser-induced damage and residue formation in the HDI process are demonstrated. The micro module systems MCM-D process was also successfully investigated for applicability to MEMS packaging. Development of MEMS compatible MCM packaging provides an alternative to monolithic fabrication for integration of MEMS and microelectronics. (C) 1998 Published by Elsevier Science S.A. All rights reserved.

引用

页码：15 / 22

页数：8

共 13 条

[1]

CHU PB, 1997, 9 INT C SOL STAT SEN, V1, P665

[2] OVERLAY HIGH-DENSITY INTERCONNECT - A CHIPS-1ST MULTICHIP MODULE TECHNOLOGY [J].

DAUM, W ;

BURDICK, WE ;

FILLION, RA .

COMPUTER, 1993, 26 (04) :23-29

[3] THEORY AND APPLICATION OF POLYSILICON RESISTOR TRIMMING [J].

FELDBAUMER, DW ;

BABCOCK, JA .

SOLID-STATE ELECTRONICS, 1995, 38 (11) :1861-1869

[4] New multichip-on-silicon packaging scheme for microsystems [J].

Guerin, L ;

Schaer, MA ;

Sachot, R ;

Dutoit, M .

SENSORS AND ACTUATORS A-PHYSICAL, 1996, 52 (1-3) :156-160

[5]

KOESTER D, MULTIUSER MEMS PROCE

[6] Optoelectronic multichip modules for high-speed computer systems and communication networks [J].

Koh, S ;

Sadler, DJ ;

Ahn, CH .

OPTICAL ENGINEERING, 1997, 36 (05) :1319-1325

[7] Use of BCB in high frequency MCM interconnects [J].

Krishnamurthy, VB ;

Cole, HS ;

SitnikNieters, T .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (01) :42-47

[8]

LYKE JC, 1995, MICROENGINEERING TEC, P131

[9] HIGH-LEVEL CAD MELDS MICROMACHINED DEVICES WITH FOUNDRIES [J].

MARSHALL, JC ;

PARAMESWARAN, M ;

ZAGHLOUL, ME ;

GAITAN, M .

IEEE CIRCUITS & DEVICES, 1992, 8 (06) :10-17

[10]

NEAMEN DA, 1992, SEMICONDUCTOR PHYSIC

← 1 2 →