Properties of SiOxNy films deposited by LPCVD from SiH4/N2O/NH3 gaseous mixture

被引:26
作者
Temple-Boyer, P
Hajji, B
Alay, JL
Morante, JR
Martinez, A
机构
[1] CNRS, LAAS, F-31077 Toulouse, France
[2] Univ Barcelona, Fac Fis, LEME, E-08028 Barcelona, Spain
关键词
LPCVD; silicon oxynitride; optical; structural properties and mechanical properties;
D O I
10.1016/S0924-4247(98)00344-6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Varied silicon oxynitride SiOxNy films are grown by low pressure chemical vapour deposition (LPCVD) from silane SiH4, nitrous oxide N2O and ammonia NH3 by adjusting the N2O/NH3 gas flow ratio. Film thicknesses and refractive indexes are measured by ellipsometry and profilometry, The SiOxNy stoichiometries are characterized by X-ray photoelectron spectroscopy (XPS) and the results are compared to the Bruggeman theory applied to the SiO2/Si3N4 heterogeneous medium. Film residual stresses are finally characterized by profilometry through wafer curvature measurements. From compressive to tensile stress values are obtained, evidencing the existence of a no-stress oxynitride film. Such phenomena are related to the SiOxNy stoichiometry and explained by considering the deposition mechanisms of the SiH4/N2O/NH3 gaseous mixture and the thermo-mechanical properties of silicon oxynitride. (C) 1999 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:52 / 55
页数:4
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