Heterogeneous materials integration: compliant substrates to active device and materials packaging

被引：4

作者：

Brown, AS ^{[1
]}

Doolittle, WA ^{[1
]}

Jokerst, NM ^{[1
]}

Kang, S ^{[1
]}

Huang, S ^{[1
]}

Seo, SW ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Microelect Res Ctr, Atlanta, GA 30332 USA

来源：

MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | 2001年 / 87卷 / 03期

关键词：

heterogeneous integration; compliant substrates;

D O I：

10.1016/S0921-5107(01)00730-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The drive for the heterogeneous integration of materials has led to significant advances in materials and device processing, and in the understanding of defect production and control during epitaxy. Heterogeneous integration is driven by microelectronic and packaging trends, and the advent of new materials, such as GaN, that do not possess native substrates. During the last decade, these objectives led to research in the development of compliant substrates. While the ideal compliant substrate concept and implementation may be flawed, this research has certainly advanced materials integration technology. This paper will provide an overview of recent results in compliant substrate experiments and interpretation, and the related advancement of materials and device integration and packaging deriving from some of this research. (C) 2001 Published by Elsevier Science B.V.

引用

页码：317 / 322

页数：6

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