3-D self-assembling and actuation of electrostatic microstructures

被引:6
作者
Quévy, E
Buchaillot, L
Collard, D
机构
[1] Inst Elect & Microelect Nord, IEMN, ISEN, F-59652 Villeneuve Dascq, France
[2] Univ Tokyo, Inst Ind Sci, Ctr Int Res Micromechatron, Tokyo, Japan
关键词
3-D shape; electrostatic actuation; microsystems; self-assembling;
D O I
10.1109/16.936715
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An advanced three-dimensional (3-D) self-assembling technique of surface micro-machined polysilicon structures is presented here for the realization of dedicated actuators for optical applications such as micro-mirrors array with large deflection angles. Three-dimensional polysilicon microparts are self-assembled by beam buckling induced by integrated scratch drive actuators (SDAs), With this technique, 380 x 250 mum(2) microplates were lifted 90 mum above the substrate plane. Once the assembling is performed, the 3-D shapes were held permanently by an integrated mechanical lock. Subsequent to the 3-D assembling, micro-mirrors were successfully actuated by biasing buried electrodes. Controlled motion up to +/- 15 degrees rotation was measured and analyzed by means of analytical models. Long-term actuations were carried out without any observable change, even for 0.5-mum thin polysilicon structures. This self-assembling technique of 3-D devices from surface micro-machining opens new integration capabilities and new applications for micro-opto-electro-mechanical system (MOEMS).
引用
收藏
页码:1833 / 1839
页数:7
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