A hierarchical reliability analysis for circuit design evaluation

被引:23
作者
Riege, SP
Thompson, CV
Clement, JJ
机构
[1] MIT, Dept Mat Sci & Engn, Cambridge, MA 02139 USA
[2] Digital Equipment Corp, Hudson, MA 01749 USA
关键词
electromigration; integrated circuit design; integrated circuit interconnections; integrated circuit reliability;
D O I
10.1109/16.725264
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We suggest a computationally efficient and flexible strategy for assessment of reliability of integrated circuits. The concept of hierarchical reliability analysis proposed relies on doing reliability assessments during the design and layout process [reliability computer aided design (RCAD)]. Design rules are suggested based on calculations of steady-state mechanical stresses built up in interconnect graphs and trees due to electromigration. These design rules identify a large fraction of interconnect graphs in a typical design as immune to electromigration-induced failure. The stated design rules are an extension of the Blech-length concept to interconnect graphs. Our suggested nem strategy will have important implications for design and layout processes as design limits for a given technology are reached.
引用
收藏
页码:2254 / 2257
页数:4
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