Characterization of electrically active dopant profiles with the spreading resistance probe

被引:46
作者
Clarysse, T
Vanhaeren, D
Hoflijk, I
Vandervorst, W
机构
[1] IMEC, B-3001 Louvain, Belgium
[2] Katholieke Univ Leuven, Dept Elect Engn, INSYS, B-3001 Louvain, Belgium
关键词
spreading resistance probe; active dopant distribution; carrier depth profiling; sheet resistance;
D O I
10.1016/j.mser.2004.12.002
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Since its original conception in the 1960s, the spreading resistance probe (SRP) has evolved into a reliable and quantitative tool for sub-micrometer, electrically active dopant, depth profiling in silicon. Its application limit has in recent years even been pushed down to ultra-shallow (sub-50 nm) structures. In this review, a systematic discussion is presented of all issues of importance for a high quality raw data collection and subsequent high accuracy data analysis. The main focus will be on the new developments over the last two decades. The qualification requirements, to be fulfilled for 10% profile accuracy (in the absence of carrier spilling) and some of the main fields for SRP application in today's industry will be covered. Finally, a critical assessment of the technique will be made, and its future roadmap will be discussed. (c) 2005 Published by Elsevier B.V.
引用
收藏
页码:123 / 206
页数:84
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