Fabrication of multi-tiered structures on step and flash imprint lithography templates

被引:23
作者
Johnson, S
Resnick, DJ [1 ]
Mancini, D
Nordquist, K
Dauksher, WJ
Gehoski, K
Baker, JH
Dues, L
Hooper, A
Bailey, TC
Sreenivasan, SV
Ekerdt, JG
Willson, CG
机构
[1] Motorola Labs, Phys Sci Res Labs, Tempe, AZ 85284 USA
[2] Univ Texas, Mat Inst, Austin, TX 78712 USA
关键词
step; flash; imprint; lithography; multi-tiered structures;
D O I
10.1016/S0167-9317(03)00075-3
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Step and flash imprint lithography (SFIL) replicates patterns by using a transparent template with relief images etched into its surface. Recent work has examined alternative methods for template fabrication. One scheme incorporates a conductive and transparent layer of indium tin oxide (ITO) on the surface of the substrate. Features are defined on the templates by patterning a thin layer of PECVD oxide that is deposited on the ITO layer. A second method bypasses the oxide etch process by imaging a thin layer of hydrogen silsesquioxane (HSQ). By combining or iterating the two methods, it is possible to form multi-tiered structures on a template. Two and three tier structures were fabricated on silicon wafers and templates. A two layer structure was fabricated on a quartz photoplate by patterning PECVD oxide and subsequently patterning a second tier using HSQ. The resulting relief structures were successfully replicated on wafers using SFIL. (C) 2003 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:221 / 228
页数:8
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