Influence of process variables on electron beam chemical vapor deposition of platinum

被引:25
作者
Beaulieu, D
Ding, Y
Wang, ZL
Lackey, WJ
机构
[1] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30322 USA
[2] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30322 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2005年 / 23卷 / 05期
关键词
D O I
10.1116/1.2050672
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Electron beam chemical vapor deposition was performed in a modified environmental scanning electron microscope to deposit platinum structures. Process variables including voltage, beam current, deposition time, dwell time, and line time were studied in statistically designed and analyzed experiments on fiber (pillar-like structures) and line (wall-like structures) deposition. Deposition rates and geometric features such as aspect ratio were optimized. Results from the experimentation showed the importance of the beam current, voltage, and adsorbate replenishment to the deposition process. Growth rates up to 0.9 mu m/min were obtained for short deposition times. (c) 2005 American Vacuum Society.
引用
收藏
页码:2151 / 2159
页数:9
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