Improved heat treatment for wafer direct bonding between semiconductors and magnetic garnets

被引：11

作者：

Yokoi, H

Mizumoto, T

Maru, K

Naito, Y

机构：

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1997年 / 36卷 / 5A期

关键词：

garnets; absorption loss; X-ray photoelectron spectroscopy rib waveguide; wafer direct bonding;

D O I：

10.1143/JJAP.36.2784

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The optical propagation loss of rib waveguides fabricated on magnetic garnet films increased upon annealing in H-2 ambient during wafer direct bonding. The heat treatment in wafer direct bonding between InP and Gd3Ga5O12 was investigated with the aim of circumventing the loss increase. The bonding was achieved by heat treatment in H-2 ambient at temperatures of less than or equal to 330 degrees C of in N-2 ambient.

引用

收藏

页码：2784 / 2787

页数：4

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