Nanoindentation testing on copper/diamond-like carbon bi-layer films

被引：22

作者：

Dwivedi, Neeraj ^{[1
,2
]}

Kumar, Sushil ^{[1
]}

机构：

[1] Natl Phys Lab CSIR, Phys Energy Harvesting Div, New Delhi 110012, India

[2] Indian Inst Technol Delhi, Dept Phys, New Delhi 110016, India

来源：

CURRENT APPLIED PHYSICS | 2012年 / 12卷 / 01期

关键词：

Plasma deposition; Nanoindentation; Cu/DLC bi-layer; DIAMOND-LIKE CARBON; MECHANICAL-PROPERTIES; SUBSTRATE;

D O I：

10.1016/j.cap.2011.06.013

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In the present work, the effect of indentation load on nano-mechanical properties of copper/diamond-like carbon (Cu/DLC) bi-layer films was explored. In addition, effect of Cu interlayer and influence of self bias on residual stress and various other nano-mechanical properties such as hardness (H) and elastic modulus (E) of Cu/DLC bi-layer films were also discussed. These Cu/DLC bi-layer films were deposited, using hybrid system involving radio frequency (RF)-plasma enhanced chemical vapor deposition and RF-sputtering units, under varied self biases from -125 to -225 V. The effect of penetration depth with varied load from 5 to 20 mN on H and E of these Cu/DLC bi-layer films was also analyzed. (C) 2011 Elsevier B. V. All rights reserved.

引用

页码：247 / 253

页数：7

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