Effect of aluminum addition on tensile properties of naturally aged Sn-9Zn eutectic solder

被引：54

作者：

Chuang, CM ^{[1
]}

Lui, TS ^{[1
]}

Chen, LH ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan

来源：

JOURNAL OF MATERIALS SCIENCE | 2002年 / 37卷 / 01期

关键词：

D O I：

10.1023/A:1013143218738

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effects of the addition of aluminum and natural aging on the tensile properties of Sn-9Zn and Sn-9Zn-0.5Al were investigated in rapidly solidified bulk specimens. Because oxidation occurs from the eutectic cell boundary of the surface and grows simultaneously into the subsurface with increased aging time, the deterioration of the tensile properties of Sn-9Zn and Sn-9Zn-0.5Al specimens correspond to the number of days it is naturally aged. The fracture characteristics of tensile fracture surface change from ductile dimples to partially dimpled and partially intergranular. The intergranular fracture behavior is attributed to the tensile cracks initiated from the surface cell boundary, cracks caused by cell boundary oxidation. This result indicates the depth of boundary oxidation that can be promoted by alloyed 0.5% aluminum. (C) 2002 Kluwer Academic Publishers.

引用

页码：191 / 195

页数：5

共 9 条

[1]

JONES DA, 1992, PRINCIPLES PREVENTIO, P43

[2]

LAMPE BT, 1976, WELD RES OCT, pS330

[3] The wetting of copper by Al Zn Sn solders [J].

Lin, KL ;

Wen, LH .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 1998, 9 (01) :5-8

[4] The microstructures of the Sn-Zn-Al solder alloys [J].

Lin, KL ;

Wen, LH ;

Liu, TP .

JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (03) :97-105

[5] NEW LEAD-FREE, SN-ZN-IN SOLDER ALLOYS [J].

MCCORMACK, M ;

JIN, S ;

CHEN, HS ;

MACHUSAK, DA .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :687-690

[6] NEW, LEAD-FREE SOLDERS [J].

MCCORMACK, M ;

JIN, S .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :635-640

[7]

NAKAMURA Y, 1998, INT EL DEV MAT S C T, P340

[8]

SEBAOUN A, 1987, MATER SCI TECH SER, V3, P241, DOI 10.1179/026708387790122800

[9] IN SEARCH OF NEW LEAD-FREE ELECTRONIC SOLDERS [J].

WOOD, EP ;

NIMMO, KL .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (08) :709-713

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