Integrated conical spring linear actuator

被引：32

作者：

Hata, S ^{[1
]}

Kato, T ^{[1
]}

Fukushige, T ^{[1
]}

Shimokohbe, A ^{[1
]}

机构：

[1] Tokyo Inst Technol, Precis & Intelligence Lab, Midori Ku, Yokohama, Kanagawa, Japan

来源：

MICROELECTRONIC ENGINEERING | 2003年 / 67-8卷

关键词：

MEMS; microactuator; electrostatic force; thin film metallic glass; 3D shape;

D O I：

10.1016/S0167-9317(03)00116-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This report details an electrostatic microactuator called the conical spring linear actuator (CSLA) which is capable of stepwise displacement vertical to the substrate. The CSLA has a moving electrode of three-dimensional conical spring shape which is placed on four base electrodes. The conical spring shape is constructed of a thin film metallic glass (TFMG) which is a new material for MEMS. TFMG is a kind of amorphous alloy and softens in a temperature range referred to as the supercooled liquid region (SCLR). The TFMG can be deformed easily into 3D forms at the SCLR. A new fabrication process is introduced which is appropriate for the integration of CSLA and the experimental driving of the integrated CSLA. The integrated CSLA exhibits 200 mum total stepwise displacement vertical to the substrate. (C) 2003 Elsevier Science B.V. All rights reserved.

引用

页码：574 / 581

页数：8

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