Defect analysis in thermal nanoimprint lithography

The fracture defect of the polymer in thermal nanoimprint lithography is studied based on numerical simulation and experiments. Hot pressing, cooling, and releasing steps in nanoimprint lithography are investigated in detail by a numerical simulation study. The applied pressure after the polymer deformation below the glass transition temperature will induce a stress concentration at the corner of the polymer pattern. On the other hand, the difference of the thermal expansion coefficients between the mold and the, substrate causes lateral strain, and the strain is concentrated at the corner of the pattern. These strains induce defects and cause fracture defects at the base part of the pattern during the mold releasing step. To eliminate the defects, the applied pressure is released below the glass transition temperature, and slow cooling is introduced to relax the stress concentration. The result shows successful fabrication of fine patterns with a high aspect ratio. (C) 2003 American Vacuum Society.