Development of preferred orientation in polycrystalline AlN thin films deposited by rf sputtering system at low temperature

The development of preferred orientation in AlN thin films deposited on silica glass substrates by rf sputtering at low substrate temperature (<150 degrees C) has been studied. The main factors controlling the preferential orientation of the AlN thin films are the ion-bombardment energies, incidence angle of the arriving particles, and deposition rate. At low pressure, a perpendicular and highly directional energetic ion-bombardment induces an orientation of the crystallites with their c-axis perpendicular to the substrate surface. At higher pressure (>15 mTorr), a spreading in the incidence angle of the arriving particles, due to gas phase collisions, favors the formation of AlN crystal tu inning. A change in the preferred orientation of the films from (0001) to (10 (1) over bar 1) for deposition rates above 1.8 Angstrom/s is observed.