Ge deep sub-micron HiK/MGpFETs with superior drive compared to Si HiK/MG state-of-the-art reference

被引:10
作者
De Jaeger, B.
Kaczer, B.
Zimmerman, P.
Opsomer, K.
Winderickx, G.
Van Steenbergen, J.
Van Moorhem, E.
Terzieva, V.
Bonzom, R.
Leys, F.
Arena, C.
Bauer, M.
Werkhoven, C.
Caymax, M.
Meuris, M.
Heyns, M.
机构
[1] IMEC, B-3001 Louvain, Belgium
[2] Katholieke Univ Leuven, B-3001 Louvain, Belgium
[3] ASM Amer, Phoenix, AZ 85034 USA
关键词
D O I
10.1088/0268-1242/22/1/S52
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work presents HiK/metal gate Ge MOSFET devices with a conventional layout and made in a complete Si-like process flow. The fabricated pFET long-channel conventional devices equal the best pFET long-channel mobility results obtained elsewhere on ring-shaped devices made with simplified process flows. The hole mobility is significantly above the Si universal, with a peak mobility value of similar to 250 cm(2) (V s)(-1). The fabricated nFET devices have electron mobility much lower than the Si universal, as is commonly observed. Also, deep sub-micron Ge pFET devices with gate lengths below 0.2 mu m have been made. The implementation of a novel NiSi-like NiGe module is key to obtain deep sub-micron devices with not only a high-mobility channel, but also with an acceptably low series resistance. 0.19 mu m deep sub-micron Ge devices with germanided source/drain regions demonstrate that the mobility enhancement observed in long-channel Ge pFETs as compared to Si HiK/metal gate pFETs can indeed result in deep sub-micron Ge devices with a higher drive.
引用
收藏
页码:S221 / S226
页数:6
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