Self-aligned InP DHBT with fT and fmax over 300 GHz in a new manufacturable technology

被引:50
作者
He, G [1 ]
Howard, J
Le, M
Partyka, L
Li, B
Kim, G
Hess, R
Bryie, R
Lee, R
Rustomji, S
Pepper, J
Kail, M
Helix, M
Elder, RB
Jansen, DS
Harff, NE
Prairie, JF
Daniel, ES
Gilbert, BK
机构
[1] Vitesse Semicond Corp, Camarillo, CA 93012 USA
[2] BAE Syst, Nashua, NH 03061 USA
[3] Mayo Clin, Special Purpose Proc Dev Grp, Rochester, MN 55905 USA
关键词
heterojunction bipolar transistor (HBT); high-speed integrated circuits; indium phosphide (InP);
D O I
10.1109/LED.2004.832528
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report self-aligned indium-phosphide double-heterojunction bipolar transistor devices in a new manufacturable technology with both cutoff frequency (f(tau)) and maximum oscillation frequency (f(max)) over 300 GHz and open-base breakdown voltage (BVceo) over 4 V. Logic circuits fabricated using these devices in a production integrated-circuit process achieved a current-mode logic ring-oscillator gate delay of 1.95 ps and an emitter-coupled logic static-divider frequency of 152 GHz, both of which closely matched model-based circuit simulations.
引用
收藏
页码:520 / 522
页数:3
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