Metallic air-bridges fabricated by multiple acceleration voltage electron beam lithography

被引：13

作者：

Borzenko, T ^{[1
]}

Gould, C ^{[1
]}

Schmidt, G ^{[1
]}

Molenkamp, LW ^{[1
]}

机构：

[1] Univ Wurzburg, Inst Phys, D-97074 Wurzburg, Germany

来源：

MICROELECTRONIC ENGINEERING | 2004年 / 75卷 / 02期

关键词：

fabrication techniques; electron beam lithography; electron resist; air-bridges;

D O I：

10.1016/j.mee.2004.05.005

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present a new method of fabricating metallic air-bridge microstructures that is based on a single layer resist and a variation of the electron energy used during the electron beam lithography process. Electrons in the range of 3-30 keV cause radiation-induced reactions in the resists to depths adjustable from fractions of a micrometer up to several micrometers. By varying the energy at which the lithography process is carried out, we obtain three-dimensional profiles in the electron beam resist after exposure and development. Air-bridge structures can then be created by metal evaporation and lift-off. (C) 2004 Elsevier B.V. All rights reserved.

引用

页码：210 / 215

页数：6

共 17 条

[1]

[Anonymous], 1997, Handbook of Microlithography, micromachining and micro fabrication

[2] Metallic air-bridges on non-planar transport structures [J].