SiC and GaN transistors - Is there one winner for microwave power applications?

被引:152
作者
Trew, RJ [1 ]
机构
[1] Virginia Polytech Inst & State Univ, Dept Elect & Comp Engn, Blacksburg, VA 24061 USA
关键词
D O I
10.1109/JPROC.2002.1021568
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Wide bandgap semiconductors show great promise for advancing the state of the art for high-power microwave electronic devices. Primarily due to low breakdown voltage, it has not been possible to design and fabricate solid-state transistors that can yield radio-frequency (RF) output power on the order of hundreds to thousands of watts necessary to compete with microwave vacuum tubes. This has, severely limited the use of microwave solid-state transistors and devices in power applications, such as transmitters for wireless communications systems, radars, etc. Recent improvements in the growth of wide bandgap semiconductor materials, such as SiC and the GaN-based alloys, provide the opportunity to now design and fabricate microwave transistors that demonstrate performance previously available only from microwave tubes. The most promising electronic devices for fabrication in wide bandgap semiconductors for these applications are metal-semiconductor field-effect transistors (MESFETs) fabricated from the 4H-SiC polytype and heterojunction field-effect transistors (HFETs) fabricated using the AlGaN/GaN heterojunction. These devices can provide RF output power on the order of 5-6 W/mm and 10-12 W/mm of gate periphery respectively. 4H-SiC MESFETs should produce useful performance at least through X band and AlGaN/GaN HFETs should produce useful performance well into the millimeter-wave region, and potentially as high as 100 GHz.
引用
收藏
页码:1032 / 1047
页数:16
相关论文
共 70 条
[11]  
DAN XA, 2001, J APP PHY, V90, P1357
[12]   Current instabilities in GaN-based devices [J].
Daumiller, I ;
Theron, D ;
Gaquière, C ;
Vescan, A ;
Dietrich, R ;
Wieszt, A ;
Leier, H ;
Vetury, R ;
Mishra, UK ;
Smorchkova, IP ;
Keller, S ;
Nguyen, NX ;
Nguyen, C ;
Kohn, E .
IEEE ELECTRON DEVICE LETTERS, 2001, 22 (02) :62-64
[13]   Monte Carlo study of the dynamic breakdown effects in HEMT's [J].
Di Carlo, A ;
Rossi, L ;
Lugli, P ;
Zandler, G ;
Meneghesso, G ;
Jackson, M ;
Zanoni, E .
IEEE ELECTRON DEVICE LETTERS, 2000, 21 (04) :149-151
[14]   Undoped AlGaN/GaN HEMTs for microwave power amplification [J].
Eastman, LF ;
Tilak, V ;
Smart, J ;
Green, BM ;
Chumbes, EM ;
Dimitrov, R ;
Kim, H ;
Ambacher, OS ;
Weimann, N ;
Prunty, T ;
Murphy, M ;
Schaff, WJ ;
Shealy, JR .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (03) :479-485
[15]   Theoretical study of RF-breakdown in bulk GaN and GaN MESFETs [J].
Farahmand, M ;
Brennan, KF ;
Gebara, E ;
Heo, D ;
Suh, Y ;
Laskar, J .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (09) :1844-1849
[16]   POWER-LIMITING BREAKDOWN EFFECTS IN GAAS-MESFET [J].
FRENSLEY, WR .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1981, 28 (08) :962-970
[17]   HIGH-FREQUENCY PERFORMANCE OF SIC HETEROJUNCTION BIPOLAR-TRANSISTORS [J].
GAO, GB ;
STERNER, J ;
MORKOC, H .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1994, 41 (07) :1092-1097
[18]  
Green BM, 2000, IEEE ELECT DEVICE LE, V21
[19]   DETECTION OF AVALANCHING IN SUBMICROMETER FIELD-EFFECT DEVICES [J].
GUPTA, MS .
IEEE ELECTRON DEVICE LETTERS, 1987, 8 (10) :469-471
[20]   Effect of polarization fields on transport properties in AlGaN/GaN heterostructures [J].
Hsu, L ;
Walukiewicz, W .
JOURNAL OF APPLIED PHYSICS, 2001, 89 (03) :1783-1789