Analysis of the production of ATLAS indium bonded pixel modules

被引：8

作者：

Alimonti, G.

Andreazza, A.

Bulgheroni, A.

Corda, G.

Di Gioia, S.

Fiorello, A.

Gemme, C.

Koziel, M.

Manca, F.

Meroni, C.

Nechaeva, P.

Paoloni, A.

Rossi, L.

Rovani, A.

Ruscino, E.

机构：

[1] Ist Nazl Fis Nucl, I-20133 Milan, Italy

[2] Univ Milan, Milan, Italy

[3] SELEX Sistemi Integrati, Rome, Italy

[4] Ist Nazl Fis Nucl, I-16146 Genoa, Italy

[5] Univ Genoa, Genoa, Italy

来源：

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT | 2006年 / 565卷 / 01期

关键词：

stripping; indium bump; pixel detector;

D O I：

10.1016/j.nima.2006.05.048

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

The ATLAS collaboration is currently building 1500 pixel modules using the indium bump bonding technique developed by SELEX Sistemi Integrati (former AMS). The indium deposition and flip-chip process are described together with an overview of the chip stripping machine that allows defective modules to be reworked. The production is half-way through at the time of this writing. This paper also discusses the problems encountered during production and the adopted solutions. (c) 2006 Elsevier B.V. All rights reserved.

引用

页码：296 / 302

页数：7

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