Study on titanium salicide process for thin-film SOI devices

被引:5
作者
Chen, J
Colinge, JP
机构
关键词
silicon-on-insulator; titanium silicide; microwave;
D O I
10.1016/S0167-9317(96)00044-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
TFSOI (Thin-Film Silicon-On-Insulator) technology has made significant progress recently. In this work, the titanium SALICIDE (Self-Aligned siLICIDE) process has been studied, optimized and applied on a CMOS-compatible TFSOI technology for low-voltage, low-power microwave applications. The gate sheet resistance and total source/drain series resistance of a TFSOI NMOSFET with a 80 nm thick active silicon layer are 6.2 Omega/square and 700 Omega.mu m, respectively, with a 30 nm thick titanium disilicide on both the gate and source/drain areas. The maximum oscillation frequency, f(max), of a 0.75 mu m TFSOI NMOSFET fabricated with this technology is equal to 11 GHz for a supply voltage of 0.9 V.
引用
收藏
页码:189 / 194
页数:6
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