Investigation into the flange problem of resist along the edge of substrate caused by spin coating

被引：8

作者：

He, YZ

Han, YL

Zhao, YG

Cao, BS

机构：

[1] Tsing Hua Univ, Dept Phys, Beijing 100084, Peoples R China

[2] Tsinghua Univ Press, Beijing 100084, Peoples R China

来源：

MICROELECTRONIC ENGINEERING | 2002年 / 63卷 / 04期

关键词：

spin coating; resist; lithography;

D O I：

10.1016/S0167-9317(02)00549-X

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The flange phenomena of the photoresist (PR) along the edge of the small substrate, caused by the spin coating process in lithography, were observed and analyzed. A facile and valid way to diminish largely the thickness of the PR flange was introduced and the corresponding experiment was carried out to prove its feasibility. (C) 2002 Elsevier Science B.V. All rights reserved.

引用

页码：347 / 352

页数：6

共 5 条

[1] AN INVESTIGATION OF THE THICKNESS VARIATION OF SPUN-ON THIN-FILMS COMMONLY ASSOCIATED WITH THE SEMICONDUCTOR INDUSTRY [J].