Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate

被引：172

作者：

Choi, WK ^{[1
]}

Lee, HM ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Taejon 305701, South Korea

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2000年 / 29卷 / 10期

关键词：

intermetallic compound growth mechanism; soldering and aging; lateral growth; Gibbs-Thompson effect; Sn-Ag-Cu system;

D O I：

10.1007/s11664-000-0014-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The formation and the growth of the intermetallic compound (IMC, hereafter) at the interface between the Sn-3.5Ag (numbers are all in wt.% unless otherwise specified) solder alloy and the Cu substrate were investigated. Solder joints were prepared by changing the soldering time at 250 degrees C from 30 sec to 10 h and the morphological change of IMCs with soldering time was observed. It resulted from the competition between the growth of IMC and the dissolution of Cu from the substrate and IMCs. They were further aged at 130 degrees C up to 800 h. During aging, the columnar morphology of IMCs changed to a more planar type while the scallop morphology remained unchanged. It was observed that the growth behavior of IMCs was closely related with the initial soldering condition.

引用

页码：1207 / 1213

页数：7

共 15 条

[1] INTERMETALLIC PHASE-FORMATION IN THIN SOLID-LIQUID DIFFUSION COUPLES [J].

BARTELS, F ;

MORRIS, JW ;

DALKE, G ;

GUST, W .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (08) :787-790

[2] Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate [J].

Choi, WK ;

Lee, HM .

JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) :1251-1255

[3] SOLID-STATE INTERMETALLIC COMPOUND GROWTH BETWEEN COPPER AND HIGH-TEMPERATURE, TIN-RICH SOLDERS .2. MODELING [J].

ERICKSON, KL ;

HOPKINS, PL ;

VIANCO, PT .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (08) :729-734

[4]

HASSEN P, 1986, PHYSICAL METALLURGY

[5]

HOWE JM, 1997, INTERFACES MAT

[6] Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening [J].

Kim, HK ;

Tu, KN .

PHYSICAL REVIEW B, 1996, 53 (23) :16027-16034

[7] Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation [J].

Lee, BJ ;

Hwang, NM ;

Lee, HM .

ACTA MATERIALIA, 1997, 45 (05) :1867-1874

[8]

MEL Z, 1992, MET T A, V23, P857

[9] REACTION-DIFFUSION IN CU-SN SYSTEM [J].

ONISHI, M ;

FUJIBUCHI, H .

TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1975, 16 (09) :539-547

[10] Theory for intermetallic phase growth between Cu and liquid Sn-Pb solder based on grain boundary diffusion control [J].

Schaefer, M ;

Fournelle, RA ;

Liang, J .

JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (11) :1167-1176

← 1 2 →