Multiple-gate SOI MOSFETs: Device design guidelines

被引:357
作者
Park, JT [1 ]
Colinge, JP
机构
[1] Univ Incheon, Dept Elect Engn, Inchon 402749, South Korea
[2] Univ Calif Davis, Dept Elect & Comp Engn, Davis, CA 95616 USA
关键词
insulated gate FETs; MOS devices; semiconductor device modeling; silicon on insulator technology;
D O I
10.1109/TED.2002.805634
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes computer simulations of various SOI MOSFETs with double and triple-gate structures, as well as gate-all-around devices. The concept of a triple-gate device with sidewalls extending into the buried oxide (hereby called a "II-gate" or "Pi-gate" MOSFET) is introduced. The Pi-gate device is simple to manufacture and offers electrical characteristics similar to the much harder to fabricate gate-all-around MOSFET. To explore the optimum design space for four different gate structures, simulations were performed with four variable device parameters: gate length, channel width, doping concentration, and silicon film thickness. The efficiency of the different gate structures is shown to be dependent of these parameters. The simulation results indicate that the the Pi-gate device is a very promising candidate for future nanometer MOSFET applications.
引用
收藏
页码:2222 / 2229
页数:8
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