'Bubble-Free' Electrochemical Delamination of CVD Graphene Films

被引：89

作者：

Cherian, Christie Thomas ^{[1
,2
]}

Giustiniano, Francesco ^{[1
,2
]}

Martin-Fernandez, Inigo ^{[1
,2
]}

Andersen, Henrik ^{[1
,2
,3
]}

Balakrishnan, Jayakumar ^{[1
,2
]}

Oezyilmaz, Barbaros ^{[1
,2
,3
]}

机构：

[1] Natl Univ Singapore, Dept Phys, Singapore 117542, Singapore

[2] Natl Univ Singapore, Graphene Res Ctr, Singapore 117542, Singapore

[3] Natl Univ Singapore, NanoCore, Singapore 117576, Singapore

来源：

SMALL | 2015年 / 11卷 / 02期

基金：

新加坡国家研究基金会;

关键词：

graphene; transfer; electrochemical; bubble; delamination; CHEMICAL-VAPOR-DEPOSITION; COPPER; SUBSTRATE; OXIDATION; GROWTH; CU;

D O I：

10.1002/smll.201402024

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

(Graph Presented) The production of large amounts of hydrogen bubbles, typical of electrochemical delamination methods based on the electrolysis of water, results in mechanical damage to graphene during the delamination, transfer, and drying steps. Here a novel 'bubble-free' delamination method is introduced which exploits the electrochemical dissolution of native copper oxide at a potential lower than that required for the formation of hydrogen bubbles, enabling the production of defect-free graphene stack. © 2014 Wiley-VCH Verlag GmbH & Co. KGaA.

引用

页码：189 / 194

页数：6

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