SiC materials: a semiconductor family for the next century

被引:18
作者
Camassel, J [1 ]
Contreras, S [1 ]
Robert, JL [1 ]
机构
[1] Univ Montpellier 2, UMR 5650 CNRS, Grp Etud Semicond, F-34095 Montpellier 5, France
来源
COMPTES RENDUS DE L ACADEMIE DES SCIENCES SERIE IV PHYSIQUE ASTROPHYSIQUE | 2000年 / 1卷 / 01期
关键词
SiC materials system; technological issues; power device applications; high temperature sensor applications; 3C-SiC/SOI;
D O I
10.1016/S1296-2147(00)00108-6
中图分类号
P1 [天文学];
学科分类号
0704 ;
摘要
The current status of SiC semiconductor materials is reviewed, with emphasize on forthcoming applications. In a first part one focuses on the most important physical properties. Then, power device and micro-opto-electronic applications, using both 4H and 6H-SiC, are presented. Technological problems which have to be: solved in order to realize simple planar device are considered. Emphasize is set on the French and European efforts, and on the USA and Japan's ones. In a second part, one deals with advanced high temperature industrial sensor applications. Interest for cubic 3C-SiC deposited on Silicon On Insulator (SOI) is demonstrated and results of comparative examinations of different 3C-SiC/SOI materials are briefly given. (C) 2000 Academie des sciences/Editions scientifiques er medicales Elsevier SAS.
引用
收藏
页码:5 / 21
页数:17
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