A new inductively coupled plasma source design with improved azimuthal symmetry control

被引:30
作者
Khater, MH [1 ]
Overzet, LJ [1 ]
机构
[1] Univ Texas, Erik Jonsson Sch Engn & Comp Sci, Plasma Applicat Lab, Richardson, TX 75083 USA
关键词
D O I
10.1088/0963-0252/9/4/310
中图分类号
O35 [流体力学]; O53 [等离子体物理学];
学科分类号
070204 ; 080103 ; 080704 ;
摘要
The geometry of an inductively coupled plasma (ICP) source impacts the plasma and processing uniformity. A reasonably uniform source design does not always guarantee a uniform plasma however, because transmission line (i.e. standing wave) effects also impact on its performance. In this work we present an ICP source design with a geometry that enables better control over the field profiles' azimuthal symmetry despite transmission line effects. The geometry is three dimensional rather than planar and consists of two layers of full and semicircular loops with the RF current generally Rowing in opposite directions. We have measured the free space magnetic fields produced by one implementation of the new source in the (r, theta) plane using a B-dot probe. The new source generated fields of higher azimuthal symmetry than the planar coil, despite a larger current variation along the new source length. We have also developed a three-dimensional electromagnetic model for ICP sources that accounts for current variations along the source length due to standing wave effects. The model showed good agreement with the measured fields for the planar coil. However, it showed less agreement for the new source design since the interaction between the loops in the different layers were not included in the model. Langmuir probe measurements showed that the new ICP source generated high density (10(11)-10(12) cm(-3)) argon and chlorine plasmas at low pressures (1-30 mTorr) at 1 cm above the wafer surface. Spatial profiles of electron temperature and ion density in a chlorine plasma at 1 cm below the dielectric window showed improved azimuthal symmetry of power deposition with the new ICP source. Polysilicon etch rate profiles on 150 mm wafers also showed improved azimuthal symmetry and uniformity with the new ICP source.
引用
收藏
页码:545 / 561
页数:17
相关论文
共 41 条
[11]   Magnetic induction and plasma impedance in a planar inductive discharge [J].
Gudmundsson, JT ;
Lieberman, MA .
PLASMA SOURCES SCIENCE & TECHNOLOGY, 1998, 7 (02) :83-95
[12]   Relative atomic chlorine density in inductively coupled plasmas containing chlorine and boron trichloride [J].
Hebner, GA ;
Fleddermann, CB .
JOURNAL OF APPLIED PHYSICS, 1998, 83 (10) :5102-5107
[13]   LANGMUIR PROBE TECHNIQUE FOR PLASMA PARAMETER MEASUREMENT IN A MEDIUM DENSITY DISCHARGE [J].
HOPKINS, MB ;
GRAHAM, WG .
REVIEW OF SCIENTIFIC INSTRUMENTS, 1986, 57 (09) :2210-2217
[14]   ELECTROMAGNETIC-FIELDS IN A RADIOFREQUENCY INDUCTION PLASMA [J].
HOPWOOD, J ;
GUARNIERI, CR ;
WHITEHAIR, SJ ;
CUOMO, JJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1993, 11 (01) :147-151
[15]   LANGMUIR PROBE MEASUREMENTS OF A RADIO-FREQUENCY INDUCTION PLASMA [J].
HOPWOOD, J ;
GUARNIERI, CR ;
WHITEHAIR, SJ ;
CUOMO, JJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1993, 11 (01) :152-156
[16]  
Hwang GS, 1997, J APPL PHYS, V81, P3433, DOI 10.1063/1.365039
[17]   Modelling and optimization of inductively coupled loop antenna plasma sources [J].
Intrator, T ;
Menard, J .
PLASMA SOURCES SCIENCE & TECHNOLOGY, 1996, 5 (03) :371-382
[18]   POWER DEPOSITION IN HIGH-DENSITY INDUCTIVELY-COUPLED PLASMA TOOLS FOR SEMICONDUCTOR PROCESSING [J].
JAEGER, EF ;
BERRY, LA ;
TOLLIVER, JS ;
BATCHELOR, DB .
PHYSICS OF PLASMAS, 1995, 2 (06) :2597-2604
[19]   Effects of gas distribution on polysilicon etch rate uniformity for a low pressure, high density plasma [J].
Khater, MH ;
Overzet, LJ ;
Cherrington, BE .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (02) :490-495
[20]   Sheath resistance measurements in the GEC reference reactor [J].
Kleber, JL ;
Overzet, LJ .
PLASMA SOURCES SCIENCE & TECHNOLOGY, 1999, 8 (04) :534-543