Cross talk countermeasures in inductive inter-chip wireless superconnect

被引：27

作者：

Miura, N ^{[1
]}

Mizoguchi, D ^{[1
]}

Sakurai, T ^{[1
]}

Kuroda, T ^{[1
]}

机构：

[1] Keio Univ, Dept Elect & Elect Engn, Keio, Japan

来源：

PROCEEDINGS OF THE IEEE 2004 CUSTOM INTEGRATED CIRCUITS CONFERENCE | 2004年

关键词：

D O I：

10.1109/CICC.2004.1358746

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Inductive coupling among stacked chips in a package enables 1.2Gb/s/channel data communications. Array arrangement of the channel increases data bandwidth, while signal may be degraded by cross talk. In this paper, cross talk is measured and analyzed, and cross talk countermeasures are discussed for the first time. Received signal waveforms by the inductive coupling are measured by embedded voltage detectors on a test chip. Interference-to-Signal Ratio (ISR) has good agreements between the measurements and calculations from a theoretical model. It is found that cross talk is reduced to negligibly small at a certain distance. If the channels are arranged at intervals of this distance, ISR is minimized. A technique based on Time Division Multiple Access (TDMA) is also proposed to further reduce cross talk.

引用

页码：99 / 102

页数：4

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