HIGH-TEMPERATURE STRESS MEASUREMENT ON CHEMICAL-VAPOR-DEPOSITED TUNGSTEN SILICIDE AND TUNGSTEN FILMS

被引:20
作者
SHIOYA, Y
IKEGAMI, K
MAEDA, M
YANAGIDA, K
机构
关键词
D O I
10.1063/1.338259
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:561 / 566
页数:6
相关论文
共 9 条
[1]   A LOW-STRESS INSULATING FILM ON SILICON BY CHEMICAL VAPOR DEPOSITION [J].
DRUM, CM ;
RAND, MJ .
JOURNAL OF APPLIED PHYSICS, 1968, 39 (09) :4458-&
[2]   STRUCTURE OF SELECTIVE LOW-PRESSURE CHEMICALLY VAPOR-DEPOSITED FILMS OF TUNGSTEN [J].
GREEN, ML ;
LEVY, RA .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (05) :1243-1250
[3]  
MELLIARSMITH CM, 1974, J ELECTROCHEM SOC, V121, P298, DOI 10.1149/1.2401800
[4]  
MURARKA SP, 1980, J VAC SCI TECHNOL, V17, P755
[5]   INSITU STRESS MEASUREMENT OF REFRACTORY-METAL SILICIDES DURING SINTERING [J].
PAN, JT ;
BLECH, I .
JOURNAL OF APPLIED PHYSICS, 1984, 55 (08) :2874-2880
[6]   PROPERTIES OF LOW-PRESSURE CVD TUNGSTEN SILICIDE FOR MOS VLSI INTERCONNECTIONS [J].
SARASWAT, KC ;
BRORS, DL ;
FAIR, JA ;
MONNIG, KA ;
BEYERS, R .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1983, 30 (11) :1497-1505
[7]   ANALYSIS OF STRESS IN CHEMICAL VAPOR-DEPOSITION TUNGSTEN SILICIDE FILM [J].
SHIOYA, Y ;
ITOH, T ;
INOUE, SI ;
MAEDA, M .
JOURNAL OF APPLIED PHYSICS, 1985, 58 (11) :4194-4199
[8]   ANALYSIS OF THE EFFECTS OF ANNEALING ON RESISTIVITY OF CHEMICAL VAPOR-DEPOSITION TUNGSTEN SILICIDE FILMS [J].
SHIOYA, Y ;
MAEDA, M .
JOURNAL OF APPLIED PHYSICS, 1986, 60 (01) :327-333
[9]  
SHIOYA Y, UNPUB