PROFILE CONTROLLED ETCHING FOR MO/WSIX DOUBLE-LAYERS

被引:6
作者
KURIYAMA, Y
SUZUKI, M
HIRAYAMA, M
机构
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS | 1986年 / 25卷 / 02期
关键词
D O I
10.1143/JJAP.25.L96
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:L96 / L98
页数:3
相关论文
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